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Heat transfer in cooling systems of microelectronic equipment with partially submerged condensers

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1 Author(s)
Kabov, O.A. ; Inst. of Thermophys., Acad. of Sci., Novosibirsk, Russia

The heat transfer in a liquid immersion cooling system for microelectronic equipment was tested. The internal volume of the module was divided into two parts with a special partition. Inert dielectric liquid MDSF was used in the experiments as a working fluid. The proposed system can reduce the influence of noncondensable gas on heat transfer at the vapor space condenser. It was determined that the average heat transfer coefficient does not substantially decrease during the condensation of vapor on the partially submerged tubes; this is due to the effect of the surface-tension-driven pressure gradient which occurs in the film of the condensate

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:19 ,  Issue: 2 )

Date of Publication:

Jun 1996

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