Close category search window
 

Hole mobility of p-type β-FeSi2 thin films grown from Si/Fe multilayers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Takakura, K. ; Kumamoto National College of Technology, 2659-2 Suya, Nishigoshi, Kikuchi, Kumamoto 861-1102, Japan ; Ohyama, H. ; Takarabe, K. ; Suemasu, T.
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.1891279 

The hole mobility of intentionally undoped p-type β-FeSi2 thin films grown by a multilayer method was investigated. With increasing annealing temperature and time, the hole mobility increased to approximately 450 cm2/V s at room temperature (RT). The observed hole mobility was analyzed by considering various carrier scatterings such as acoustic-phonon and polar-optical-phonon scatterings, intervalley scattering, ionized impurity scattering, and grain-boundary scattering. The nice fit of the mobility to the experimental results reveals that the polar-optical-phonon scattering determines the hole mobility at RT.

Published in:
Journal of Applied Physics  (Volume:97 ,  Issue: 9 )

Date of Publication: May 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.