Cart (Loading....) | Create Account
Close category search window

Effect of magnetic field on the magnetic properties of electroplated NiFe/Cu composite wires

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Li, X.P. ; Department of Mechanical Engineering and Division of Bioengineering, National University of Singapore, Singapore 119260 ; Zhao, Z.J. ; Seet, H.L. ; Heng, W.M.
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link: 

The effect of the magnetic field on the magnetic properties of NiFe/Cu composite wires electroplated under a longitudinal magnetic controlling field is presented. Composite wire samples of 20-μm-diameter Cu electroplated with a layer of Permalloy™ (Ni80Fe20) under the influence of a longitudinal magnetic field of intensities ranging from 0 to 400 Oe were produced, and the microstructure and magnetic properties were measured. The results showed that the longitudinal magnetic field in the composite wire plating makes the packing of the crystals in the plated layer more orderly, and thus increases the uniformity and magnetic softness of the plated material. It also shifts the magnetic anisotropy of the plated layer from circumferential to longitudinal, and increases the critical frequency of the plated composite wire in magnetoimpedance effect testing, at which the magnetoimpedance ratio reaches the maximum. © 2003 American Institute of Physics.

Published in:

Journal of Applied Physics  (Volume:94 ,  Issue: 10 )

Date of Publication:

Nov 2003

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.