Cart (Loading....) | Create Account
Close category search window

High resolution electrical studies of vacancy-rich and interstitial-rich regions in ion-implanted silicon

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Abdelgader, N. ; Department of Electrical Engineering and Electronics, UMIST, Manchester, M60 1QD United Kingdom ; Evans-Freeman, J.H.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

A combination of high resolution Laplace deep level transient spectroscopy (LDLTS) and direct capture cross-section measurements has been used to investigate whether deep electronic states related to interstitial-type defects introduced by ion implantation originated from point or extended defects, prior to any annealing. n-type silicon was implanted with doses of 1×109cm-2 of silicon, germanium, or erbium, and comparison was made with proton- and electron-irradiated material. When measured by LDLTS at 225 K, the region of the implant thought to contain mostly vacancy-type defects exhibited a complex spectrum with five closely spaced defect-related energy levels, with energies close to EC-400 meV. The region nearer the tail of the implant, which should be dominated by interstitial-type defects, exhibited a simpler LDLTS spectrum with three closely spaced levels being recorded, again with energies centered on EC-400 meV. Annealing at 180 °C did not completely remove any of the defect peaks, suggesting that the energy levels were not due to the simple vacancy-phosphorus center. Direct electron capture cross-section measurements revealed that the defects in the tail of the implanted volume, prior to any annealing, were not simple point defects, as they exhibited nonexponential capture properties. This is attributed to the presence of extended defects in this region. By contrast, defects with the same activation energy in proton- and electron-irradiated silicon exhibited point-defect-like exponential capture. © 2003 American Institute of Physics.

Published in:

Journal of Applied Physics  (Volume:93 ,  Issue: 9 )

Date of Publication:

May 2003

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.