Cart (Loading....) | Create Account
Close category search window
 

Ion beam etching of lead–zirconate–titanate thin films: Correlation between etching parameters and electrical properties evolution

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Soyer, C. ; Department of Materials for Integration in Microelectronics and Microsystems (MIMM), Université de Valenciennes, Z. I. du Champ de l’Abbessse, 59600 Maubeuge, France ; Cattan, E. ; Remiens, D. ; Guilloux-Viry, M.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.1476970 

Ion beam etching of sputtered Pb(Zrx,Ti1-x)O3 (PZT) with x equal to 0.54 thin films grown on Pt/Ti/SiO2/Si substrates has been performed using pure Ar gas. The etch rate dependence on the process parameters (current density, acceleration voltage, gas pressure) has been investigated. The PZT etch rate can reach 600 Å/min with acceleration voltage of 1000 V and current density of 1 mA/cm2. Selectivity ratios between PZT and masks of various natures (photoresist, Pt, Ti) have been evaluated to determine a pertinent material for etching mask. According to our etching conditions, titanium seems to be the best candidate. We evaluated the PZT surface damage by contact mode atomic force microscopy. It appears that the roughness increases after ion bombardment, and that the grain boundary zone is preferentially etched. For some etching parameters, we also observed electrical damage. Carrying out C(V) and hysteresis loops P(E) measurements before and after etching have provided evidence of degradation. We noted a large decrease in permittivity after the etching process irrespective of the current density and acceleration voltage. Ferroelectric damage was illustrated by a large increase in the average coercive field. For each of the electrical properties under study, the same behavior has been observed after etching: the increase of damage was obtained as a function of the current density and acceleration voltage. The evolution of electrical properties when the PZT layer is protected by a metallic mask has also been studied. We observed very slight variations in the electrical properties. © 2002 American Institute of Physics.

Published in:

Journal of Applied Physics  (Volume:92 ,  Issue: 2 )

Date of Publication:

Jul 2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.