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Electromigration-induced resistance behavior of via-terminated metal lines was studied. We found a strong correlation between void morphology and step-like resistance behavior. For the lines which exhibit pronounced resistance steps, voids are formed at the top or bottom Al/TiN interface. For the lines which exhibit gradual resistance increases, only complete void formation severing the whole line occurs. The step-like resistance behavior is more pronounced when the current density is close to the critical current density. Possible mechanisms for the resistance steps are discussed. © 2001 American Institute of Physics.
Published in:
Journal of Applied Physics
(Volume:89
,
Issue:
4
)
Date of Publication: Feb 2001
- Page(s):
- 2130 - 2133
- ISSN :
- 0021-8979
- Digital Object Identifier :
- 10.1063/1.1340004
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 18 June 2009
- Issue Date :
- Feb 2001
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