By Topic

Simulation of physical vapor deposition into trenches and vias: Validation and comparison with experiment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
OSullivan, Peter L. ; Bell Laboratories, Lucent Technologies, Murray Hill, New Jersey 07974 ; Baumann, Frieder H. ; Gilmer, George H.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

We have performed two-dimensional (2D) and three-dimensional (3D) (axisymmetric) numerical simulations of physical vapor deposition into high aspect ratio trenches and vias used for modern very large-scale integration interconnects. The topographic evolution is modeled using (continuum) level set methods. The level set approach is a powerful computational technique for accurately tracking moving interfaces or boundaries, where the advancing front is embedded as the zero level set (isosurface) of a higher dimensional mathematical function. We have validated both codes against analytic formulas for step coverage. First, we study the 2D case of long rectangular trenches including 3D out-of-plane target flux. The 3D flux can be obtained from molecular dynamics computations, and hence our approach represents a hybrid atomistic/continuum model. Second, we report results of axisymmetric 3D simulations of high aspect ratio vias, which we compare with experimental data for Ti/TiN barrier layers. We find that the simulations (using a cosine angular distribution for the flux from the target) overpredict bottom coverage in some cases by approximately 20%–30% for both collimated and uncollimated deposition, but in other cases provide a reasonably accurate comparison with experiment. © 2000 American Institute of Physics.

Published in:

Journal of Applied Physics  (Volume:88 ,  Issue: 7 )