Cart (Loading....) | Create Account
Close category search window

Co–Cr films prepared by sputtering using electron cyclotron resonance microwave plasma

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Yamamoto, S. ; Faculty of Engineering, Yamamaguchi University, Tokiwadai, Ube 755, Japan ; Sato, K. ; Kurisu, H. ; Matsuura, M.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

The sputtering deposition using an electron cyclotron resonance (ECR) microwave plasma was tried to use in the fabrication of the Co–Cr perpendicular magnetic recording media. As the Ar sputtering gas pressure increased from 4×10-2 to 8×10-2 Pa, the Co(002) x‐ray diffraction peak intensity increased and the half‐value width of the rocking curve Δθ50 decreased. This result implies that Co–Cr films with high perpendicular orientation and good crystallinity are achieved at high Ar gas pressure. The Co–Cr films deposited at a target to substrate distance of 230 mm had a good preferred crystal orientation (Δθ50 less than 4°), high perpendicular magnetic anisotropy (Hk higher than 4 kOe), and high perpendicular coercivity over 1400 Oe even though the Co–Cr thickness is as small as about 50 nm, and no underlayers were introduced. Thus, the ECR sputtering has high potential in the deposition of the Co–Cr films for ultrahigh density recording media. © 1996 American Institute of Physics.

Published in:

Journal of Applied Physics  (Volume:79 ,  Issue: 8 )

Date of Publication:

Apr 1996

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.