Close category search window
 

High-performance, low-noise enhancement-mode pseudomorphic high-electron-mobility transistor with gate recession by citric acid/hydrogen peroxide selective etching

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Wang, Chih-Cheng ; Institute of Microelectronics, Department of Electrical Engineering, and Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan ; Lin, Yu-Ju ; Huang, Hou-Kuei ; Wu, Chang-Luen
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.2753848 

An enhancement-mode pseudomorphic high-electron-mobility transistor (E-PHEMT) using a citric acid/hydrogen peroxide etching solution for gate recession is developed. The etch selectivity between GaAs and Al0.2Ga0.8As is more than 165 at 22 °C, while the maximum transconductance for the fabricated device with the gate dimension of 160×0.25 μm2 reaches 502 mS/mm at Vds=2.7 V. Furthermore, at 12 GHz, the 1 dB compression output power and gain can reach 13.2 dB m and 17.9 dB, respectively. Operating at 12 GHz, the minimum noise figure at the bias conditions of Vds=2 V and Ids=11 mA decreases to 0.45 dB with the associated gain of 12.95 dB, which is comparable to, or even better than that of, reported low-noise depletion- or enhancement-mode PHEMT devices. The standard deviation of the pinch-off voltage for the E-PHEMT across a 4 in. diameter wafer could be as low as 50 mV.

Published in:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:25 ,  Issue: 4 )

Date of Publication: Jul 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.