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Surface micromachining of a thin film microresonator using dry decomposition of a polymer sacrificial layer

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3 Author(s)
Patil, S.B. ; INESC Microsistemas e Nanotecnologias, Lisbon 1000–029, Portugal ; Chu, V. ; Conde, J.P.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.2715972 

Fabrication of thin film silicon bridge microresonators on glass substrates using an unzipping sacrificial polymer has been demonstrated. Polynorbornene, which can be thermally decomposed at ∼425 °C, has been used as the sacrificial layer, allowing a simple, fully dry sacrificial layer removal. The polynorbornene is spin coated onto the substrate and patterned by photolithography. A thin film silicon structural layer is deposited by rf plasma-enhanced chemical vapor deposition and patterned to form a microbridge. The microbridges are electrostatically actuated and the resulting deflection is measured optically. The fabricated microbridges show resonance frequencies of the order of ∼4.4 MHz and quality factors ∼450.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:25 ,  Issue: 2 )

Date of Publication:

Mar 2007

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