Cart (Loading....) | Create Account
Close category search window

Unique application of atomic force microscopy and scanning capacitance microscopy-two-dimensional-carrier profiling through thick insulating layers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Chao, Kuo‐Jen ; Evans Analytical Group LLC, 810 Kifer Road, Sunnyvale, California 94086

Your organization might have access to this article on the publisher's site. To check, click on this link: 

Atomic force microscopy [Binnig etal, Phys. Rev. Lett. 56, 930 (1986)] and scanning capacitance microscopy [Williams etal, Appl. Phys. Lett. 55, 203 (1989)] (AFM/SCM) have been applied to study various implant structures of semiconductor devices. In this work, we present a unique application of AFM/SCM in two-dimensional-carrier profiling through a thick insulating layer. Therefore, AFM/SCM can be applied to delineate the lateral dopant diffusion and even to determine the lateral dopant diffusion length. In addition, an interesting phenomenon is observed when applying AFM/SCM to reveal the lateral dopant diffusion geometries on two different shapes of mask corners: one an obtuse corner and the other an acute corner. While it is reasonable and easily accepted that an obtuse corner in the mask would generally make the corresponding corner of the dopant-diffused region rounder, a shaper corner of the dopant-diffused region is observed on a corresponding acute corner in the mask. This demonstrates the utility of AFM/SCM in process control and failure analysis. Furthermore, three failed Si devices were studied by top-down AFM/SCM. These analyses show that the SCM images are clearly able to identify the nature and location of the three different types of defects. These random defects would be difficult to locate using more conventional cross-sectional analyses.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:24 ,  Issue: 1 )

Date of Publication:

Jan 2006

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.