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Assembled micro-electromechanical-systems microcolumn from a single layer silicon process

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5 Author(s)
Saini, R. ; Zyvex Corporation, 1321 North Plano Road, Richardson, Texas 75081 ; Jandric, Z. ; Tsui, K. ; Udeshi, T.
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We report a novel microcolumn fabrication method using automated micro-electro-mechanical-systems (MEMS) assembly. Different microcolumn components, including deflectors, lens elements, and apertures, are fabricated on a highly doped 50 μm thick silicon-on-insulator (SOI) wafer. These components with compliant connectors are then assembled onto compliant MEMS sockets fabricated on the same wafer using MEMS NanoEffectors™ and automated assembly. The self-aligning nature of MEMS sockets yields submicron lateral alignment and less than 0.1° angular misalignment. The measured resonant frequency is 593 Hz for first generation assembled components; the footprint of the microcolumn is less than 1 cm2. We have successfully built a mechanical prototype microcolumn for technology demonstration and as a proof of concept. Second generation design is under development.

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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:22 ,  Issue: 6 )