Cart (Loading....) | Create Account
Close category search window
 

Synthesis of tin-incorporated nanocomposite diamond like carbon films by plasma enhanced chemical vapor deposition and their characterization

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Kundoo, S. ; Department of Physics, Jadavpur University, Kolkata - 700 032, India ; Saha, P. ; Chattopadhyay, K.K.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.1815318 

Sn-incorporated nanocomposite diamond like carbon (DLC) films were synthesized using direct current plasma enhanced chemical vapor deposition method. The precursor gas used was acetylene. For Sn incorporation, SnCl2∙2H2O dissolved in methanol was used. Fourier-transform infrared spectroscopy measurements showed different vibrational modes of tetrahedrally bonded carbon and also some small peaks due to SnC bonding vibrations. Transmission electron microscopy image and electron diffraction patterns also confirmed the incorporation of nanocrystalline Sn particles into the amorphous DLC matrix. Due to the presence of Sn clusters, the Tauc gap of the films decreased sharply, compared to the intrinsic material. It was found that the resistivity of Sn-incorporated DLC films decreased drastically (by eight orders of magnitude) compared to the undoped DLC film. Also, the films exhibited good field emission properties at a lower turn-on field.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:22 ,  Issue: 6 )

Date of Publication:

Nov 2004

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.