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System optimization of membrane mask distortion correction based on Fourier analysis

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3 Author(s)
Murooka, Ken-ichi ; Research and Development Center, Toshiba Corporation, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 212-8582, Japan ; Lim, M.H. ; Smith, Henry I.

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We have studied the distortion correction scheme of a membrane mask in the spatial frequency domain by using Fourier analysis. The relationship between stress and distortion tells us that distortion is inversely proportional to spatial frequency, which means the high spatial frequency component of the stress has little effect on the distortion. Also, the Fourier analysis of the thermal diffusion compensation tells us that the heat input is required to be large as the spatial frequency becomes large, i.e., the upper limit of the heat input power gives the upper limit of the correctable spatial frequency in the distortion correction. Assuming that the total heat input power is 100 W, and the membrane is 1 μm thick SiNx in air, it turned out that the acceptable stress in low spatial frequency region is about 200 MPa, and the distortion correction system is required to have only the spatial frequency corresponding to the wavelength of 0.26 mm or more, which can be easily implemented with a commercially available 640×480 Video Graphics Array resolution system.

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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:22 ,  Issue: 5 )