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Silicon microcombs developed at our laboratory for the precision alignment and assembly of large-area foil optics have previously been demonstrated to achieve submicron-level assembly repeatability with submillimeter-thick flat substrates. In this article we report on a double-side deep reactive-ion etch fabrication process using silicon-on-insulator wafers which was developed to improve the microcombs’ manufacturing accuracy. © 2003 American Vacuum Society.
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures (Volume:21 , Issue: 6 )
Date of Publication: Nov 2003