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Evolution of intrinsic stress in nanocrystalline-diamond film deposited by continuous H+ ion bombardment

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2 Author(s)
Gu, C.Z. ; The State Key Laboratory of Surface Physics, Institute of Physics, Chinese Academy of Science, 100080 Beijing, China ; Jiang, X.

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An in situ bending-plate method is used to measure intrinsic stress during the growth process of nanocrystalline-diamond film. Nanometer-sized diamond film is prepared by continuous H+ ion bombardment under different energies induced by applying a negative-bias voltage at the substrate relative to the grounded-vacuum chamber using the microwave-plasma chemical-vapor-deposition (MWPCVD) method. The effects of substrate-bias voltage, temperature, total pressure, and CH4 concentration on intrinsic stress during the film-growth process are investigated. The results indicate that high bias voltage and high substrate temperature are beneficial when synthesizing smooth nanocrystalline-diamond film. This film usually relates to high intrinsic compressive stress. This stress can be attributed to the high secondary-nucleation rate and grain-boundary density. The evolution of intrinsic stress presents a complicated process at different pressures and CH4 concentrations. The compressive stress of the film can be controlled by modifying the grain size at various deposition parameters. © 2003 American Vacuum Society.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:21 ,  Issue: 5 )

Date of Publication:

Sep 2003

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