Cart (Loading....) | Create Account
Close category search window
 

Investigation of macroscopic uniformity during CH4/H2 reactive ion etching of InP and its improvement by use of a guard ring

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Janiak, K. ; Heinrich-Hertz-Institut für Nachrichtentechnik Berlin GmbH, Einsteinufer 37, 10587 Berlin, Germany ; Niggebrugge, U.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.1428276 

We investigated the wafer uniformity of the etch attack obtained by reactive ion etching of InP in a CH4/H2 plasma. We found that this process inherently tends to produce a rather nonuniform distribution of etch rates across InP wafers with the fastest etching occuring at the wafer edge. Nonuniformities of up to 35% are observed. We propose a simple model, which explains the observation by reactants, which originate from nonetched regions, diffuse parallel to the wafer surface, and locally enhance the etch rate. The nonuniformity can be efficiently counteracted by a proper choice of the process pressure or even completely avoided by the introduction of a guard ring. In addition we also found that the arrangement of the masked areas on the wafer influences the etch rate profile. © 2002 American Vacuum Society.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:20 ,  Issue: 1 )

Date of Publication:

Jan 2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.