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Mechanical characterization of electron-beam resist using micromachined structures

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3 Author(s)
Que, L. ; Department of Electrical and Computer Engineering, Center for Nano Technology, University of Wisconsin, Madison, Wisconsin 53706 ; Gianchandani, Y.B. ; Cerrina, F.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.591052 

In this effort the residual strain in exposed negative tone SAL 605 and unexposed positive tone APEX-E resists was characterized for a variety of processing conditions using surface micromachined bent-beam strain sensors fabricated with resist as the structural material. Results showed that SAL 605 is in 1035–1230 μstrain compression, whereas APEX-E is in 653–690 μstrain tension for the conditions tested. Residual stress in APEX-E was also determined by wafer curvature measurements. The ratio of the residual stress to strain at room temperature indicated that the Young’s modulus of this material is 21±5 GPa. The temperature dependence of the stress indicated that the glass transition temperature for APEX-E is 118±2 °C, and its coefficient of thermal expansion is 11.0±2.5 ppm/K. © 1999 American Vacuum Society.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:17 ,  Issue: 6 )

Date of Publication:

Nov 1999

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