By Topic

400 kHz radio‐frequency biased electron cyclotron resonance plasma etching for Al–Si–Cu patterning

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
3 Author(s)
Samukawa, S. ; VLSI Development Division, NEC Corporation, 1120 Shimokuzawa Sagamihara, Kanagawa 229, Japan ; Toyosato, Tomohiko ; Wani, Etsuo

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.585452 

A radio‐frequency (rf) biased electron cyclotron resonance (ECR) plasma etching technology with efficient ion acceleration in high density and uniform ECR plasma for accurate Al–Si–Cu alloy film etching has been developed. Substrate is located at the ECR position (875 G position) and etching is carried out with 400 kHz rf bias power. This technology achieves high etching rate (more than 5000 Å/min), excellent uniformity (±5%), highly anisotropic and Cu residue‐free etching using only Cl2 and Cl2/BCl3 gas plasma at a low 100 °C substrate temperature. These characteristics are achieved by the combination of dense and uniform ECR plasma generation and efficient accelerated ion flux at the ECR position by using 400 kHz rf bias.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:9 ,  Issue: 3 )