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Non-radial non-uniformity in chemo-mechanical polishing

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5 Author(s)
Huang, V.S.K. ; Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Clear Water Bay, Hong Kong ; Nguyen, C.T. ; Chan, A.B.Y. ; Ling, C.C.
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Within-wafer non-uniformity due to chemo-mechanical polishing (CMP) is classified in this paper as belonging to two classes: radially symmetric (radial), and not radially symmetric (non-radial). While radial non-uniformity has been well-treated both theoretically and empirically in the literature, the equally important problem of non-radial non-uniformity has received little attention. We identify the significance of the latter here through a series of CMP experiments, and propose a straightforward intermediate solution

Published in:

Microelectronics and VLSI, 1995. TENCON '95., IEEE Region 10 International Conference on

Date of Conference:

6-10 Nov 1995

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