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Electrical performance of interconnects in polyimide-copper thin-film multilayers on ceramic substrate

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3 Author(s)
Bedouani, Mohamed ; Bull SA, Les Clayes sous Bois, France ; Lambert, D. ; Kurzweil, K.

Thin-film multilayer substrate technology with dielectric layers made of polyimide resin requires openings on the ground plane for the outgassing of the resin. This paper describes a full electrical characterization of transmission lines in a multichip module based on thin-film multilayer on ceramic. Both time and frequency domain methods were used for the experimental characterization. Measured and modeled performances are compared for three kinds of ground opening geometries

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 2 )