By Topic

Effect of adhesive surface chemistry and morphology on package cracking in tapeless lead-on-chip (LOC) packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Amagai, M. ; NPD Dept., Texas Instrum., Oita, Japan

The increasingly severe demands of concurrently increasing die size, while reducing package size, have made the mechanical stability of novel tapeless lead-on-chip (LOC) packaging technologies a grave concern. The dominant issue is device failure, due to package cracking, caused by interfacial delamination between the adhesive-coated chip surface and the epoxy molding compound. To investigate the effect of adhesive surface morphology and chemistry on the epoxy molding compound, devices were fabricated with different types of adhesives. The samples were characterized with scanning acoustic tomography (SAT), X-ray photo emission spectroscopy (XPS), atomic force microscopy (AFM), attenuated total reflection (ATR), peel tests, and various package-level reliability tests. The results of the characterization and an explanation of the primary factors affecting interfacial adhesion are presented in this paper

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 2 )