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Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling

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2 Author(s)
Strauss, G. ; Microwave Tech., Ulm Univ., Germany ; Menzel, W.S.

Standard interconnect and packaging techniques for millimeter-wave monolithic integrated circuits (MIMIC's) tend to get more and more difficult at millimeter-wave frequencies due to the increased influence of discontinuities and tolerances, especially in conjunction with temperature and hermetic sealing. To overcome these problems, a novel concept is proposed based on electromagnetic field coupling. On this basis, coupling structures for feed-throughs out of a package as well as chip interconnects have been designed, fabricated, and tested in a scaled frequency range and in the original millimeter-wave frequency range showing good results with acceptable tolerance requirements

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 2 )

Date of Publication:

May 1996

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