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A novel macro-via crystal (MVPC) structure is proposed for suppression of PPNs in high-speed or mixed signal circuit package. This structure is designed by periodically embedding macro-via cylinders, which consist of six vias and two circular pads, between the power and ground planes. Compared with previously proposed EBG structures, several advantages have been demonstrated. First, etching slots or high-density vias are not required. It will have better SI and PI performance for the package. Second, it can be fabricated in the typical and low-cost package process. Third, significant routing space is available on the layers between power and ground planes. A test sample was fabricated in the package substrate. Excellent PPN suppression has been presented from 1.8 GHz to 5.6 GHz. Agreement between the measurement and simulation is favorably good.