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Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions

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2 Author(s)
Ki Jin Han ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA ; Swaminathan, M.

For the successful electrical design of system-in-package, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems. Additional enhancement schemes proposed further reduce the cost for computing the partial inductances. Therefore, the method discussed in this paper can be used to construct accurate models of a large number of 3-D interconnection structures such as more than 100 bonding wires used for stacking chips.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:28 ,  Issue: 6 )

Date of Publication:

June 2009

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