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Package compatibility and substrate dependence of granular soft magnetic material CoFeHfO developed by reactive sputtering

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7 Author(s)
Liangliang Li ; Department of Materials Science and Engineering, Stanford University, Stanford, California 94305 ; Wang, Shan X. ; Hwang, Kyu-Pyung ; Yongki Min
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Integration of magnetic passive components into package has been attracting more interests recently, but efficient package-compatible magnetic materials are needed. We have developed a package-compatible granular material, CoFeHfO, on a printed circuit board by reactive sputtering and investigated the substrate dependence of its soft magnetic property. Atomic force microscopy and grazing incidence x-ray-scattering-diffraction spectra show that a rough substrate surface degrades the magnetic property of CoFeHfO thin films with almost the same crystal microstructure. With surface planarization by chemical-mechanical polishing, soft magnetic material CoFeHfO can be realized on the package substrate. This material is promising for future applications in package.

Published in:

Journal of Applied Physics  (Volume:99 ,  Issue: 8 )

Date of Publication:

Apr 2006

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