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Kinetics of Si incorporation into a Ge matrix for Si1-xGex layers grown by chemical vapor deposition

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4 Author(s)
Tomasini, P. ; ASM America Inc., 3440 E. University Dr., Phoenix, Arizona 85034, USA ; Bauer, M. ; Cody, N. ; Arena, C.

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The growth rate and alloy composition of Si1-xGex layers grown in an industrial chemical vapor deposition (CVD) system have been analyzed as functions of the process parameters at a pressure enabling selective epitaxial growth. We systematically investigate the growth of Si1-xGex with 0.48≪x≪0.8, using GeH4/SiCl2H2 partial pressure ratios up to 1.12, where the GeH4 flow was constant and the SiCl2H2 flow was varied. Epitaxial growth temperatures spanned from 350 to 600 °C. The growth rate and alloy composition were limited by the surface reaction step with an activation energy of 1 eV/mol. A significant growth rate reduction is observed when increasing Si content. This feature is consistent with a passivation of the surface Si bonds with H and Cl atoms typical of chemical vapor deposition Si1-xGex layer growth. It is found empirically that x/(1-x)∝pDCSΔn, Δn=0.32, where x is the Ge mole fraction and pDCS is the SiCl2H2 partial pressure. Then we tentatively de- velop a model to support the empirical laws found without making any assumption on the mechanism and we extend it to the full compositional range of CVD grown Si–Ge alloys.

Published in:

Journal of Applied Physics  (Volume:99 ,  Issue: 7 )