Cart (Loading....) | Create Account
Close category search window
 

Magnetic properties and microstructure of Fe/Pt multilayer films capped with SiO2 amorphous layer for magnetic recording use

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Ding, Y. ; Division of Natural Science, Ming Hsin University of Science and Technology, Hsinchu 304, Taiwan ; Wei, D.H. ; Yao, Y.D.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.2830004 

Fe/Pt multilayer films capped with an amorphous SiO2 layer have been fabricated in order to study the microstructure and magnetic properties via a molecular beam epitaxy technique at 400 °C. The formation of granularlike FePt films was obtained with this process due to the interpenetration of SiO2 which has a lower surface energy. Studies of angular dependent coercivity show a tendency of a domain-wall motion weaken toward rotation of reverse-domain type upon thickness of SiO2 capping layer atop the Fe/Pt multilayer films. The intergrain interaction was confirmed from the Kelly–Henkel plot that indicated the exchange coupling between neighboring grains in the uncapped FePt films. On the other hand, negative δM value was obtained when the FePt films capped with SiO2 layer, indicating that the SiO2 capping layer can lead to the reduction of intergrain exchange coupling in SiO2/FePt films.

Published in:

Journal of Applied Physics  (Volume:103 ,  Issue: 7 )

Date of Publication:

Apr 2008

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.