Cart (Loading....) | Create Account
Close category search window
 

Electrochemical deposition of FeGa/NiFe magnetic multilayered films and nanowire arrays

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Lupu, N. ; National Institute of Research and Development for Technical Physics, 47 Mangeron Boulevard, RO-700050 Iaşi, Romania ; Chiriac, H. ; Pascariu, P.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.2832353 

Results concerning the preparation and characterization of electrochemically deposited (Fe1-xGax/Fe1-yNiy)n (x=0.1–0.3 at. %; y=0.4–0.8 at. %) multilayered films and nanowires arrays are reported for the first time. The layers have been deposited successively by changing the electrodeposition potential. The combination of Fe1-xGax magnetostrictive material and Fe1-yNiy soft magnetic material shows good magnetic softness (Hc does not exceed 60 G s) and gives novel magnetostrictive behavior caused by the formation of twisted spin structures.

Published in:

Journal of Applied Physics  (Volume:103 ,  Issue: 7 )

Date of Publication:

Apr 2008

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.