Cart (Loading....) | Create Account
Close category search window

Thermal fluctuations in magnetic nanoparticles: Numerical testing of Langevin approach

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Ragusa, C. ; Dipartimento di Ingegneria Elettrica, Politecnico di Torino, I-10129 Torino, Italy ; Serpico, C. ; Repetto, M. ; dAquino, M.
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link: 

Thermal fluctuations for fine ferromagnetic particles are studied. First, a derivation of the fluctuation-dissipation relation for the stochastic (Langevin-type) Landau–Lifshitz equation is carried out. Then, the Fokker–Planck analysis of fluctuations in uniformly magnetized particles is compared with the full micromagnetic analysis based on numerical integration of the spatially discretized Langevin–Landau–Lifshitz equation. The relevance of these results to the formulation of a meaningful “standard problem” for micromagnetic analysis of thermal fluctuations in magnetic nanoparticles is finally discussed.

Published in:

Journal of Applied Physics  (Volume:103 ,  Issue: 7 )

Date of Publication:

Apr 2008

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.