Cart (Loading....) | Create Account
Close category search window

Surface micromachined accelerometers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Boser, B.E. ; Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA ; Howe, R.T.

Surface micromachining has enabled the cofabrication of thin-film micromechanical structures and CMOS or bipolar/MOS integrated circuits. Using linear, single-axis accelerometers as a motivating example, this paper discusses the fundamental mechanical as well as the electronic noise floors for representative capacitive position-sensing interface circuits. Operation in vacuum lowers the Brownian noise of a polysilicon accelerometer to below 1 μg/√(Hz). For improved sensor performance, the position of the microstructure should be controlled using electrostatic force-feedback. Both analog and digital closed-loop accelerometers are described and contrasted, with the latter using high-frequency voltage pulses to apply force quanta to the microstructure and achieve a very linear response

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:31 ,  Issue: 3 )

Date of Publication:

Mar 1996

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.