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Modeling and analysis of substrate coupling in integrated circuits

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2 Author(s)
R. Gharpurey ; Circuit Technol. Lab., Texas Instrum. Inc., Dallas, TX, USA ; R. G. Meyer

This paper describes a fast and accurate simulator for characterizing the effects of substrate coupling on integrated-circuit performance. The technique uses the electrostatic Green function of the substrate medium and the fast Fourier transform algorithm. It is demonstrated that this technique is suitable for optimization of layout for minimization of substrate coupling. Analysis of substrate coupling in different types of substrates and the utility of guard rings in different types of substrates is also discussed. Experimental verification of the models is presented

Published in:

IEEE Journal of Solid-State Circuits  (Volume:31 ,  Issue: 3 )