By Topic

The interrelation between adhesion, contact creep, and roughness on the life of gold contacts in radio-frequency microswitches

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Gregori, Giuliano ; California NanoSystems Institute, University of California at Santa Barbara, Santa Barbara, California 93106-5050 and Materials Department, University of California at Santa Barbara, Santa Barbara, California 93106-5050 ; Clarke, David R.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

With repeated actuation, an increasing adhesive force develops between the gold contacts of radio-frequency microswitches until failure eventually occurs by stiction. Detailed characterization of the contact forces and the contact surfaces as a function of actuation cycles for “cold-switched” devices indicates that the increase in adhesive forces in air is attributed to mechanical creep of the polycrystalline gold contacts. The increase in adhesion is observed to be associated with an increase in contact area and depth of contact impression as well as asperity flattening. These morphological observations are related to the propensity for stiction using two nondimensional numbers, the plasticity index ψ and the adhesion parameter θ. Trajectories of the evolution of contact roughness in terms of these two numbers provide insight into the design of contacts to resist stiction.

Published in:

Journal of Applied Physics  (Volume:100 ,  Issue: 9 )