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Mechanical properties of thick, surface micromachined polysilicon films

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7 Author(s)
Kahn, H. ; Dept. of Mater. Sci. & Eng., Case Western Reserve Univ., Cleveland, OH, USA ; Stemmer, S. ; Nandakumar, K. ; Heuer, A.H.
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Polycrystalline silicon is the most widely used structural material for surface micromachined microelectromechanical systems (MEMS). There are many advantages to using thick polysilicon films; however, due to process equipment limitations, these devices are typically fabricated from polysilicon films less than 3 μm thick. In this work, microelectromechanical test structures were designed and processed from thick (up to 10 μm) undoped and in situ boron-doped polysilicon films. The elastic moduli of the doped films were 150±30 GPa, and appeared to be independent of film thickness. The thermal oxidation of the polysilicon induced a compressive stress into the top surface of the films, which was detected as a residual stress in the polysilicon after the device fabrication was complete. The average nominal fracture toughness of the polysilicon was 2.3±0.1 MPa √m

Published in:

Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE, The Ninth Annual International Workshop on

Date of Conference:

11-15 Feb 1996

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