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Combining experimental and simulation methods for the mechanical characterisation of lead free solder alloys under high strain rate loads

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4 Author(s)
Meier, K. ; Electron. Packaging Lab., Tech. Univ. Dresden, Dresden ; Roellig, M. ; Wiese, S. ; Wolter, K.-J.

The scope of the paper is to present the result of combining experimental and simulation methodologies to determine mechanical material properties at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used in the experiments. Stress-strain data recorded at high strain rates proof the high resolution capability of a novel tensile setup. A FEM model of the experiment is designed and used for evaluation of the experimental results. Explicit solver technology enables the analysis of this kind of highly dynamic scenario. Finally, conclusions for the mechanical behaviour of the used lead free solder alloy under high strain rate loads will be drawn.

Published in:

Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on

Date of Conference:

26-29 April 2009