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The scope of the paper is to present the result of combining experimental and simulation methodologies to determine mechanical material properties at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used in the experiments. Stress-strain data recorded at high strain rates proof the high resolution capability of a novel tensile setup. A FEM model of the experiment is designed and used for evaluation of the experimental results. Explicit solver technology enables the analysis of this kind of highly dynamic scenario. Finally, conclusions for the mechanical behaviour of the used lead free solder alloy under high strain rate loads will be drawn.