Cart (Loading....) | Create Account
Close category search window

Friction and wear properties of thin films of carbon with diamond structure prepared by ionized deposition

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Okada, Katsuzo ; Department of Mechanical Engineering, Faculty of Engineering, Yamanashi University, Takeda‐4, Kofu 400, Japan ; Namba, Yoshikatsu

Your organization might have access to this article on the publisher's site. To check, click on this link: 

The friction and wear properties for thin films of carbon with diamond structure, prepared by ionized deposition, slid with copper have been examined in a pressure range of 5×10-4 to 105 Pa. The friction coefficient shows a tendency to decrease with the increase of pressure and it is ≪0.2 because the surfaces of thin films of carbon with diamond structure are very smooth. The specific wear rate of copper sliders decreases as the pressure becomes lower. However, no wear is detected on thin films of carbon with diamond structure.

Published in:

Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films  (Volume:7 ,  Issue: 2 )

Date of Publication:

Mar 1989

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.