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Browse Journals & Magazines > Journal of Vacuum Science & T ...> Volume:25 Issue:6 Help

Understanding tin plasmas in vacuum: A new approach to tin whisker risk assessment

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2 Author(s)
Mason, M.S. ; Electronics and Photonics Laboratory, The Aerospace Corporation, El Segundo, California 90245 ; Eng, G.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.2796181 

This study examines the mechanisms governing sustained tin plasma formation in vacuum. The authors have experimentally demonstrated that sustained tin plasmas can form in vacuum at dc power supply voltages as low as 4 V, and present a qualitative model for the observed voltage and current signatures associated with tin plasma formation. Engineering estimates were developed to help quantify tin whisker risk as a function of power supply voltage. Implications for space applications are also discussed.

Published in:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films  (Volume:25 ,  Issue: 6 )

Date of Publication: Nov 2007

Page(s):
1562 - 1566
ISSN :
0734-2101
Digital Object Identifier :
10.1116/1.2796181
Product Type:
Journals & Magazines
Date of Current Version :
18 June 2009
Issue Date :
Nov 2007

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