By Topic

Particle transport in a parallel-plate semiconductor reactor: Chamber modification and design criterion for enhanced process cleanliness

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Nijhawan, Sandeep ; Department of Mechanical Engineering, University of Minnesota, 111 Church Street, SE, Minneapolis, Minnesota 55455 ; McMurry, Peter H. ; Campbell, Stephen A.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

Convective, diffusive, and thermophoretic particle transport in a parallel-plate semiconductor reactor is investigated. Measurements that illustrate particle transport in the reactor are presented and a Eulerian continuum particle transport formulation is used to quantitatively explain the measurements. Experimental and numerical results show that particles formed in the parallel-plate region are confined in a thin sheath (∼2 cm) between the “hot” wafer and “cold” showerhead inlet. This sheath is located at the point where downward convective transport balances upward transport by thermophoresis. The particle sheath location is independent of particle size but is dependent on gas flow rates and temperature of the wafer and showerhead inlet. In addition, experimental and numerical results show that as particles exit the parallel-plate region, the radial thermophoretic particle transport can produce “ring-like” contaminant deposits on the outer wall of the reactor under certain flow conditions. We propose a simple reactor design modification and an analytic design criterion to avoid particle deposition on the chamber walls. © 2000 American Vacuum Society.

Published in:

Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films  (Volume:18 ,  Issue: 5 )