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This paper presents a process study dedicated to packaging using film transfer technology. The key points of this process are the nickel micromoulding step for the formation of the protective caps, the bonding and separation steps from the protective caps to carrier wafer. For this process, lines of photosensitive BCB are used as intermediate adhesive material between the host wafer (supporting the MEMS) and the microcaps. The release step of the caps with the carrier wafer is realized by an anti-sticking layer.
Date of Conference: 1-3 April 2009