Cart (Loading....) | Create Account
Close category search window

The sintering temperature effects on the electrical and dielectric properties of Li0.05Ti0.02Ni0.93O ceramics prepared by a direct thermal decomposition method

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Thongbai, P. ; Department of Physics, Khon Kaen University, Khon Kaen 40002, Thailand ; Yamwong, T. ; Maensiri, S.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

We reported the effects of grain size on high dielectric and related electrical properties of Li0.05Ti0.02Ni0.93O (LTNO) ceramics, which were prepared by a direct thermal decomposition method. The analysis of complex impedance indicated that these LTNO ceramics were electrically heterogeneous consisting of conducting grains and insulating grain boundaries (GBs). Interestingly, our results revealed that the dielectric permittivity ) increases with the increase in grain size, which can be well described by Maxwell–Wagner relaxation model. Furthermore, we also found that the activation energy required for relaxation process (Ea) and related activation energy of the conductivity in the grain interior (Eg) decreased with the increase in grain size. These results suggested that the different microstructures resulted in chemical change (e.g., oxygen vacancies) inside the grains, leading to the changes in electrical properties of the LTNO ceramics.

Published in:

Journal of Applied Physics  (Volume:104 ,  Issue: 7 )

Date of Publication:

Oct 2008

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.