Notification:
We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Frequency-Division Bidirectional Communication Over Chip-to-Chip Channels

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Bichan, M. ; Dept. of Electr. & Comput. Eng., Univ. of Toronto, Toronto, ON ; Hossain, M. ; Carusone, A.C.

Frequency division multiple access is applied to bidirectional communication over chip-to-chip links. Frequency division is implemented by dividing the spectrum into low-frequency (dc) and high-frequency (ac) bands using a simple LC filter. The nonidealities that this filter introduces are compensated for with a transmitter/receiver pair that can recover signals in both bands. The receiver uses a dual-path topology that includes hysteresis to recover data from a signal with no dc content. The transmitter is a 6-tap (FIR) pre-emphasis equalizer with variable tap spacing. In simulation, the transmitter and receiver simultaneously communicate error-free at 8 Gb/s over the ac channel and at 500 Mb/s over the dc channel. Measurements shows that the ac and dc signals can be individually recovered and that the two signals occupy distinct frequency bands.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:32 ,  Issue: 2 )