By Topic

System-level thermal modeling and co-simulation with hybrid power system for future all electric ship

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Ruixian Fang ; Department of Mechanical Engineering, University of South Carolina, Columbia, USA ; Wei Jiang ; Jamil Khan ; Roger Dougal

This paper presents an approach to performing thermal-electrical coupled co-simulation of hybrid power system and cooling system of future all-electric Navy ships. The goal is to study the transient interactions between the electrical and the thermal sub-systems. The approach utilizes an existing solid oxide fuel cell (SOFC) /gas turbine (GT) hybrid electrical power model and the ship cooling system model developed on the virtual test bed (VTB) platform at University of South Carolina. The integrated system simulation approach merges the thermal modeling capacity with the electrical modeling capacity in the same platform. The paper first briefly discusses the dynamic SOFC / GT hybrid engine system combined with propulsion plant model. It then describes ship cooling system model and the interactions between the electrical and the thermal sub-systems. A simple application scenario has been implemented and analyzed to illustrate the simulation. Dynamic responses of coupled thermal-electrical systems are explored under a step change of the service load to reveal important system interactions.

Published in:

2009 IEEE Electric Ship Technologies Symposium

Date of Conference:

20-22 April 2009