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Atomic force microscopy study of plastic deformation and interfacial sliding in Al thin film: Si substrate systems due to thermal cycling

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2 Author(s)
Chen, M.W. ; Center for Materials Science and Engineering, Department of Mechanical Engineering, Naval Postgraduate School, Monterey, California 93943 ; Dutta, I.

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A method is proposed to measure the plastic deformation of thin metallic films on Si substrates induced by thermal cycling. The cross-sectional profiles of pattern-grown square Al films with a thickness of ∼250 nm and a size of ∼6 μm×6 μm were measured before and after thermal cycling by employing an atomic force microscope. With the assistance of statistical analysis, the change in the size and shape of the thin films were determined. Based on theoretical considerations, the thermal cycling deformation of thin films is attributed to creep and plasticity effects, accommodated by diffusion-controlled interfacial sliding. © 2000 American Institute of Physics.

Published in:

Applied Physics Letters  (Volume:77 ,  Issue: 26 )