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We have studied the early stages of annealing in boron implanted silicon. In a grazing incidence diffuse scattering investigation of implantation-induced defects, we have observed narrow diffuse rods of intensity along 〈111〉 directions. These diffuse streaks arise from stacking faults formed during annealing in the 1000 °C range. From the width of the diffuse streak the average size of the stacking fault is 71 nm in diameter. These intensity rods are distinct from the point defect or point defect cluster scattering in the tails of the Bragg peak (Huang scattering). From the q dependence of the scattered intensity in the Huang scattering region we find clear evidence for defect clusters with an average effective size of 4 nm, remarkably independent of the annealing temperature. These observations are discussed in the context of the enhanced diffusion of implanted boron over its bulk value referred to as transient enhanced diffusion. © 2000 American Institute of Physics.