By Topic

Annealing dynamics of nitrogen-implanted GaAs films investigated by current–voltage and deep-level transient spectroscopy

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Chen, J.F. ; Department of Electrophysics, National Chiao Tung University, Hsinchu 30050, Taiwan, Republic of China ; Wang, J.S. ; Huang, M.M. ; Chen, N.C.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

We present electrical data to show that, after nitrogen implantation, GaAs films become resistive after high-temperature annealing. The activation energies of the resistance are determined to be 0.34, 0.59, and 0.71 eV after annealing at 500, 700, and 950 °C, respectively. The increase in the activation energy with increasing annealing temperature can be explained by the results of traps detected in deep-level transient spectroscopy, where two traps at 0.32 and 0.70 eV are observed in the samples after annealing. The intensity of the trap at 0.32 eV is found to reduce by annealing. By comparing to the result of the x-ray diffraction, we suspect that this trap is related to the lattice-expansion defects. The trap at 0.70 eV is observed only in samples annealed at high temperatures. Since this trap contributes to the high-resistive effect, we believe that it is associated with the nitrogen ions. © 2000 American Institute of Physics.

Published in:

Applied Physics Letters  (Volume:76 ,  Issue: 16 )