By Topic

The ferroelectric properties of c-axis oriented Pb5Ge3O11 thin films prepared by metalorganic chemical vapor deposition

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Li, Tingkai ; Sharp Microelectronics Technology, Inc., Camas, Washington 98607 ; Zhang, Fengyan ; Hsu, Sheng Teng

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.123955 

C-axis oriented ferroelectric Pb5Ge3O11 thin films were prepared on Pt/Ir-coated Si wafers by metalorganic chemical vapor deposition (MOCVD) and rapid thermal process annealing techniques. The films were specular and crack free and showed complete crystallization with c-axis orientation for growth temperatures between 500 and 550 °C. Good ferroelectric properties were obtained for a 150-nm-thick film with Pt/Ir electrodes: the remanent polarization (2Pr) and coercive field (2Ec) values were about 3.8 μC/cm2 and 93 kV/cm, respectively. The films also showed excellent fatigue characteristics: no fatigue was observed up to 1×109 switching cycles. The leakage current increased with increasing applied voltage, and is about 3.6×10-7 A/cm2 at 100 kV/cm. The dielectric constant showed behavior similar to most ferroelectric materials in that the dielectric constant changed with applied voltages. The maximum dielectric constant is about 45. High-quality MOCVD Pb5Ge3O11 films can be used for single transistor ferroelectric memory devices. © 1999 American Institute of Physics.

Published in:

Applied Physics Letters  (Volume:74 ,  Issue: 2 )