By Topic

Low cycle fatigue of surface-mounted chip-carrier/printed wiring board joints

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Solomon, H.D. ; Gen. Electr. Co., Schenectady, NY, USA

Chip carrier/printed wiring board joints have been tested isothermally, at 35°C, in shear. The joints were subjected to fully reversed ramp cycling with fixed plastic displacement limits. The fatigue life was correlated to this displacement by a pseudo Coffin-Manson law. The fatigue life was defined in terms of a 25%, 50%, 90%, and 100% drop in the load required to produce a given displacement. The resistance of each of 22 joints was also measured and Nf defined in terms of the first joint to increase by 0.02%, 0.05%, 0.1% 1%, 10%, and 100% as well as 10 ×. The results were found to be in general agreement with those obtained previously on single, larger solder joints. Some variations were noted in the Coffin-Manson exponent, depending on how the displacement and fatigue lives were defined. This is discussed along with a model describing the process of joint failure. A set of displacement versus fatigue life curves that can be used to estimate the joint life on the basis of a variety of criteria is provided

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:12 ,  Issue: 4 )