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The IEEE Gel Task Force-an early look at the final testing

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1 Author(s)
Balde, J.W. ; IDC Corp., Flemington, NJ, USA

In 1986, the IEEE convened a Task Force to explore the chip protection afforded through the use of silicone gels. There have been three rounds of testing: two to determine the promise and expectations of the technology, and the third to qualify the test sites. The overall thrust of the Task Force was to determine whether a thin coating of silicone gel on the surface of the semiconductor chip would provide corrosion protection equal to or perhaps better than the protection afforded by a ceramic hermetically sealed package. Six types of coating were used: five gels and, for comparison, one cell of silicone rubber. The results are summarized

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:12 ,  Issue: 4 )