A strained InGaN contact layer inserted between Pd/Au and p-type GaN resulted in low ohmic contact resistance without any special treatments. The thickness and In mole fraction of the p-type InGaN varied from 2 nm to 15 nm and from 0.14 to 0.23, respectively. Strained InGaN layers are effective in reducing the contact resistance. A contact layer of 2 nm thick strained In0.19Ga0.81N showed the lowest specific contact resistance of 1.1×10-6 Ω cm2. The mechanism for the lower contact resistance is ascribed to enhanced tunneling transport due to large polarization-induced band bending at the surface as well as to the high hole concentration in p-type InGaN. © 2001 American Institute of Physics.
Published in:
Applied Physics Letters
(Volume:79
,
Issue:
16
)
Date of Publication:
Oct 2001
- Page(s):
-
2588
-
2590
- ISSN :
-
0003-6951
- Digital Object Identifier :
-
10.1063/1.1410336
- Date of Current Version :
-
18 June 2009
- Issue Date :
-
Oct 2001