By Topic

Scanning acoustic force microscopy characterization of thermal expansion effects on the electromechanical properties of film bulk acoustic resonators

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
San Paulo, A. ; Berkeley Sensors and Actuators Center, University of California, Berkeley, California 94720-1770 ; Liu, X. ; Bokor, J.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.1866508 

This letter demonstrates the application of scanning acoustic force microscopy for the characterization of film bulk acoustic resonators beyond detection of the gigahertz vibration amplitude and acoustic wave field imaging. We present a method to measure thermal expansion effects on these resonators by modulating the driving signal amplitude and then varying the modulation frequency from a few hertz to several tens of kilohertz. For the particular device considered here, we show the influence of thermal expansion effects on its electromechanical response and the acoustic wave field images. The thermal relaxation time constant of the resonator is measured and compared with a theoretical estimation based on the heat transfer analysis of the system.

Published in:

Applied Physics Letters  (Volume:86 ,  Issue: 8 )